Xiaomi, in collaboration with MediaTek, is creating buzz in the tech community with its upcoming CIVI 3 smartphone, touted as the world's first device to feature the Dimensity 8200-Ultra processor. Recently, the smartphone allegedly made an appearance on Geekbench, showcasing its new chipset ahead of its official launch. This article explores the leaked information about the Xiaomi CIVI 3 and the implications of its potential specifications.
A Shift from Qualcomm to Dimensity
Xiaomi's CIVI series, known for its Qualcomm Snapdragon 7-series processors, is making a transition to MediaTek's Dimensity 8000-based processors. However, the third generation of the series will be equipped with the latest Dimensity 8200 processor instead of an entirely new SoC. This collaboration between Xiaomi and MediaTek aims to offer users an enhanced mid-range smartphone experience.
Geekbench Leak
Prior to its official launch, the Xiaomi CIVI 3 purportedly appeared on the Geekbench database, indicating its presence as one of the latest devices running Android 13. The device is identified by the model number "23046PNC9C," which suggests a new Xiaomi model. Notably, the leaked benchmark results demonstrate that the CIVI 3 shares the same core configuration and frequency profile as the Dimensity 8200-powered vivo I2238, also known as the iQOO Neo7 SE. Both devices feature a top speed of 3.1GHz, highlighting the potential performance capabilities of the CIVI 3.
Benchmark Performance
According to the Geekbench listing, the CIVI 3 achieved single-core and multi-core scores of 1148 and 3356, respectively. These scores are remarkably similar to those of the iQOO Neo7 SE, which, in some cases, even outperforms the CIVI 3 despite having 8GB of RAM compared to the CIVI 3's 12GB. This raises questions about the CIVI 3's ability to differentiate itself from the existing device and generate excitement among potential buyers.
Implications and Expectations
With the leaked benchmark scores, the Xiaomi CIVI 3 must prove that the inclusion of the "8200-Ultra" SoC offers more than just a minor refresh. As an upcoming mid-range device, it needs to offer compelling features and performance improvements to compete effectively in the market. While the leaked Geekbench scores indicate a decent performance level, it remains to be seen how the CIVI 3 will stand out from its competition.
Dimensity 8200-Ultra SoC
The Dimensity 8200-Ultra SoC is MediaTek's latest offering in the mid-range segment. It features an octa-core CPU configuration, including high-performance Cortex-A78 cores and power-efficient Cortex-A55 cores. The chipset is built on a 6nm process, which delivers a balance between performance and power efficiency. MediaTek's Dimensity 8200-Ultra is expected to provide enhanced AI capabilities, improved gaming performance, and faster 5G connectivity.
Android 13 and RAM Configuration
Another exciting aspect revealed by the Geekbench leak is the possibility of the Xiaomi CIVI 3 launching with Android 13 out of the box. This suggests that Xiaomi is committed to delivering the latest software experience to its users. Furthermore, the leaked information also indicates that the CIVI 3 will come with a substantial 12GB of RAM, which should ensure smooth multitasking and efficient app performance.
