MediaTek's 3nm Stunner: Dimensity 9400 Dominates!

Dimensity 9400

MediaTek, a prominent player in the semiconductor industry, has recently achieved a significant milestone. The company has successfully manufactured its first-ever 3 nm System-on-Chip (SoC), and according to renowned leaker Digital Chat Station, it is likely to be the Dimensity 9400.

The Advancements in MediaTek's 3 nm SoC

MediaTek's announcement of its groundbreaking 3 nm mobile Application Processor (AP) heralds a new era in semiconductor technology. This SoC boasts impressive performance improvements, with a remarkable 18% increase in speed compared to its predecessor. Additionally, it offers a substantial 32% enhancement in power efficiency, a crucial factor in today's mobile devices.

Consumers eagerly anticipating the release of this cutting-edge chip won't have to wait too long. MediaTek plans to make it commercially available in the latter half of 2024, promising an exciting upgrade for mobile devices.

The Snapdragon 8 Gen 4 Rivalry

While MediaTek's achievement is impressive, the semiconductor industry is abuzz with discussions about Qualcomm's Snapdragon 8 Gen 4. The Snapdragon 8 Gen 3 is all but confirmed to be manufactured on TSMC's N4 family of nodes. However, the choice of fabrication for the Snapdragon 8 Gen 4 has sparked considerable debate.

Interestingly, MediaTek's immediate competitor, the Dimensity 9400, has not garnered as much attention in these debates. In this article, we explore what MediaTek and the leaker, Digital Chat Station, have revealed about this upcoming flagship SoC for 2024.

MediaTek's Breakthrough: Taping Out the 3 nm Chip

MediaTek has officially confirmed the successful production of its 3 nm chip on TSMC's manufacturing lines. This achievement is nothing short of remarkable, as it represents a significant leap in semiconductor fabrication technology.

Aside from the impressive speed and power efficiency improvements mentioned earlier, MediaTek's 3 nm chip also boasts a 60% increase in logic density. This is a critical metric, as it directly impacts the chip's performance and capabilities.

While the exact node or SKU (Stock Keeping Unit) of this 3 nm chip isn't explicitly specified in MediaTek's announcement, it's reasonable to assume that it belongs to the N3E node. This assumption is based on the fact that Apple has already secured the majority of the capacity on TSMC's N3B node, leaving N3E as the likely candidate for MediaTek's cutting-edge chip.

The Dimensity 9400: What to Expect

Digital Chat Station, a well-known source for tech leaks, has provided insights into the chip in question, confirming it to be the Dimensity 9400. This aligns with expectations, especially since the Dimensity 9300 is believed to have already entered mass production on TSMC's N4P node.

Recent rumors have suggested that the Dimensity 9300 may feature four Cortex-X4 and four Cortex-A720 CPU cores. If these rumors hold true, we can anticipate the Dimensity 9400 to follow suit, offering a powerful combination of processing capabilities.

Qualcomm's Snapdragon 8 Gen 4: Manufacturing Dilemmas

Interestingly, Digital Chat Station also provided insights into Qualcomm's Snapdragon 8 Gen 4. This highly anticipated chip is said to feature six Nuvia Phoenix L cores and two Phoenix M cores. What's intriguing is that, like MediaTek's chip, the Snapdragon 8 Gen 4 is reported to be manufactured on the N3E node.

This development contradicts an earlier report suggesting that Qualcomm might consider Samsung Foundry's 3GAP node for its SoC manufacturing needs. However, given the capacity constraints at TSMC, dual-sourcing, or using multiple fabrication facilities, could still be on the table for Qualcomm.


In conclusion, MediaTek's successful taping out of its first-ever 3 nm SoC, likely to be the Dimensity 9400, marks a significant achievement in semiconductor technology. With remarkable improvements in speed, power efficiency, and logic density, this chip promises to elevate the performance of future mobile devices.

As the industry eagerly awaits the release of MediaTek's 3 nm SoC, the competition, particularly from Qualcomm's Snapdragon 8 Gen 4, adds further intrigue to the evolving semiconductor landscape. The choice of fabrication node and the potential for dual-sourcing underscore the complexities and competitiveness of the semiconductor market.

Keywords: MediaTek, 3 nm SoC, Dimensity 9400, TSMC, Snapdragon 8 Gen 4, N3E node, 2024 flagship SoC, Digital Chat Station, power efficiency, logic density, Cortex-X4, Cortex-A720, Apple N3B capacity, Samsung Foundry 3GAP node, Mobile AP, semiconductor manufacturing.

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